发明名称 CHIP CARD WITH SOLDERED CHIP MODULE AND METHOD OF ITS MANUFACTURING
摘要 <p>Plastic contact or combined chip card, which is provided with chip module (1), soldered to plastic core (2) through at least one additional opening (9), made in the substrate (7) of the chip module (1) and situated out of the chip encapsulation (10) and seating opening (12), utilizing at least one additional contact (14), adequately seated on plastic core (2). Plastic card is produced by laminating together, after the appropriately adapted substrate (7) has been mounted into the chip module (1), or, as the case may be, antenna is soldered on, chip module (1) and possibly antenna are seated and additional contacts (14) are soldered on.</p>
申请公布号 WO2000036559(A1) 申请公布日期 2000.06.22
申请号 CZ1998000053 申请日期 1998.12.11
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