发明名称 LASER PROCESSING
摘要 The invention provides a system (10, 33) and method for vaporizing a target structure (24) on a substrate (22). According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure (24). Then, for the incident beam energy, the energy expected to be deposited in the substrate (22) as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate (22), the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system (10) is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate (22). The laser output (13, 14, 15, 16, 18 & 20) is directed at the target structure (24) on the substrate (22) at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate, in order to vaporize the target structure (24).
申请公布号 WO0035623(A1) 申请公布日期 2000.06.22
申请号 WO1999US29820 申请日期 1999.12.16
申请人 GENERAL SCANNING, INC.;LAUER, WILLIAM;TREPANIER, PIERRE;SMART, DONALD, VICTOR;CORDINGLEY, JAMES;PLOTKIN, MICHAEL 发明人 LAUER, WILLIAM;TREPANIER, PIERRE;SMART, DONALD, VICTOR;CORDINGLEY, JAMES;PLOTKIN, MICHAEL
分类号 H01L21/3205;B23K26/02;B23K26/06;B23K26/08;B23K26/10;B23K26/36;B23K26/40;H01L21/304;H01L21/768;H01L23/52;H01L23/525;H01L27/10;H01S3/00 主分类号 H01L21/3205
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