SEMICONDUCTOR CHIP AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To connect a semiconductor chip to a wiring board. SOLUTION: Blind holes 236a are formed in a second soft resin-made insulation layer 236 and filled vias 239 are formed by Cu plating in the blind holes 236a. Since the stress caused by the thermal expansion difference between the semiconductor chip 30 and a substrate 50 is small and not concentrated, no crack occurs in electric connections and the semiconductor chip can be mounted on the substrate at a high connection reliability.