发明名称 Quantum conductive recrystallization barrier layers for semiconductor devices
摘要 <p>Reduced scale structures of improved reliability and/or increased composition options are enabled by the creation and use of quantum conductive recrystallization barrier layers. The quantum conductive layers are preferably used in trench capacitors between: the interface (58) of conductive strap (56) and substrate (60); the interface (62) of trench electrode (50) and strap (56); or the interface (64) of collar oxide (48) and strap (56) to act as recrystallization barriers. The quantum conductive barrier layer can be selected from the group consisting of silicon nitride, silicon oxynitride, alumina, germanium oxide and yttria-stabilized zirconia, and can have a thickness of about 5-30 Å .</p>
申请公布号 EP1011138(A2) 申请公布日期 2000.06.21
申请号 EP19990309873 申请日期 1999.12.08
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;SIEMENS AKTIENGESELLSCHAFT 发明人 CHALOUX, SUZAN E.;CHEN, TZE-CHIANG.;FALTERMEIER, JOHNATHAN E.;GRUENING, ULRIKE;JAMMY, RAJARAO;MANDELMAN, JACK A.;PARKS, CHRISTOPHER C.;PARRIES, PAUL C.;RONSHEIM, PAUL A.;WANG, YUN-YU
分类号 H01L21/8242;B82B1/00;H01L21/20;H01L21/334;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L21/8242
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