发明名称 |
Verfahren zum elektrischen Verbinden eines Kontaktfeldes eines Halbleiterchips mit zumindest einer Kontaktfläche sowie danach hergestellte Chipkarte |
摘要 |
<p>The invention concerns a method of electrically connecting a semiconductor chip (1) to at least one contact surface by means of a thin wire whose first end is welded to the at least one contact surface and whose second end is connected to a contact area of the semiconductor chip (1). In order to establish a good connection between the wire and the contact area of the semiconductor chip (1), the second end of the wire is welded to a wedge-shaped metal part (5) which is disposed on the contact area of the semiconductor chip (1) and is conductively connected thereto. The metal part (5) is formed by a nailhead contact (6) whose free end is guided in a loop and connected to the nailhead by a wedge contact.</p> |
申请公布号 |
DE19535775(C2) |
申请公布日期 |
2000.06.21 |
申请号 |
DE1995135775 |
申请日期 |
1995.09.26 |
申请人 |
SIEMENS AG |
发明人 |
HEITZER, JOSEF;STAMPKA, PETER;KIRSCHBAUER, JOSEF |
分类号 |
H01L21/60;B23K20/00;H01L21/607;(IPC1-7):H01L23/50;G06K19/077;H05K3/32 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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