| 摘要 |
<p>A method for making a circuit device having at least one peripheral interconnect (16) for electrically connecting the device (10) to another circuit device on a motherboard, includes forming at least one opening (54) in a substrate, the opening having an inner surface extending between first and second major surfaces of the substrate. The inner surface of the opening and portions of the major surfaces adjacent the opening are coated with electrically conductive material (56). Electrically conductive material is removed from opposing regions of the inner surface of the opening prior to plating and then, after plating, the substrate is cut in a line extending across opposing regions to expose the coated and plated inner surface as the peripheral electrical interconnect. The method produces interconnects with reduced contamination by conductive particulates. &lt;IMAGE&gt;</p> |
