| 摘要 |
Compositions of the following are used as structural adhesives with good low-temperature impact strength: (A) a copolymer with epoxide-reactive groups and glass transition temperature(s) at -30 deg C or below, or its reaction product with a polyepoxide, (B) a reaction product of a polyurethane prepolymer and a poly-phenol or aminophenol and (C) epoxy resin(s). Independent claims are also included for (a) a composition for use as an adhesive which contains, in addition to components (A, B, C), (D) a latent hardener selected from dicyandiamide, guanamines, guanidines, aminoguanidines and solid aromatic diamines, and/or a hardening accelerator, (E) optional plasticizers, reactive diluents, rheology improvers, fillers, wetting agents and/or antioxidants and/or stabilizers, (F) a polyester-polyol with a mol. wt. of 400-5000 and (G) optionally a thermoplastic polymer powder; (b) a method for hardening these compositions by heating at 80-210 (preferably 120-180) deg C; (c) a method for bonding metallic and/or composite materials by applying the composition described in (a) to at least one of the joint surfaces, bringing the parts together, optionally pregelling the adhesive and then curing as in (b).
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