发明名称 |
APPARATUS FOR MANAGING HEAT IN A COMPUTER ENVIRONMENT OR THE LIKE |
摘要 |
<p>To manage heat in a computer environment or the like, a base plate and/or a input/output (I/O) plate includes an integrated heat pipe. For example, the base plate, located between a bottom surface of a laptop computer chassis and a printed circuit board (PCB) or motherboard would include a heat-pipe network that draws heat away from the heat generating components of the PCB (e.g., a processor) and distributes the heat over the base plate. The I/O plate may also serve the same purpose, located at an end of the PCB. The base plate heat pipe and I/O plate heat pipe are thermally coupled together or are of a unitary design so as to distribute the heat generated in the laptop computer over a larger area achieving a relatively low-temperature isothermal design.</p> |
申请公布号 |
EP1010054(A1) |
申请公布日期 |
2000.06.21 |
申请号 |
EP19980943475 |
申请日期 |
1998.08.27 |
申请人 |
INTEL CORPORATION |
发明人 |
BHATIA, RAKESH;PADILLA, ROBERT, D. |
分类号 |
F28D15/02;G06F1/20;H05K7/20;(IPC1-7):G06F1/20;F25D23/12;F28D15/00 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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