Construction of IC card to prevent breakage of semiconductor chip, with strengthening plate laid over semiconductor chip

摘要

Card has strengthening plate (10) on top of semiconductor chip (6) to strengthen it and covering layer (4) on top of strengthening layer to protect semi-conductor chip. Thickness of strengthening plate is selected according to predetermined formula and plate is made of material with Young's modulus of 100 to 300 Gigapascal.