发明名称 LOCAL SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a compact local soldering device easily coping with a change of object to be soldered. SOLUTION: Plural movable local nozzles 13 are arranged at the inside of a soldering bath 12 containing a molten solder 11 respectively movably freely forwards and backward to an object 14 to be soldered on the soldering bath 12. Pressurized molten solder is guides to the rear face of the object 14 by the movable local nozzles 13. The soldering bath 12 and the object 14 are relatively and movably arranged in the X direction and the Y direction.
申请公布号 JP2000167661(A) 申请公布日期 2000.06.20
申请号 JP19980344531 申请日期 1998.12.03
申请人 TAMURA SEISAKUSHO CO LTD 发明人 MASUDA TSUGUNORI;ONOZAKI JUNICHI;SAITO KOJI;TAKAHASHI KAZUHIKO
分类号 B23K1/00;B23K1/08;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K1/00
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