| 摘要 |
This invention provides taped electronic components and a method of taping electronic components which can be used when a plurality of components are to be automatically mounted by an automatic mounting device. Sideways motion and twisting of the components are thereby prevented, and a plurality of components can be accurately positioned at predetermined intervals by taping leads in position. Leads on both edges of these components are arranged to be longer than other leads, and these longer leads are held in position by a tape. Further, after forming the leads and tie-bars in a one-piece construction when the leads are formed, the inner leads are cut short and the tie-bars are held in position with tape.
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