发明名称 Semiconductor manufacturing apparatus for transferring articles with a bearing-less joint and method for manufacturing semiconductor device
摘要 In order to manufacture a semiconductor device of high performance a small-sized transfer arm mechanism, capable of retaining a predetermined transfer stroke, is put to practical use without any increase in the height of the arm mechanism. The transfer arm includes arcuate portions having center axes different from each other, and restraint generating means for generating restraints in directions where the individual center axes are attracted. This way, a plurality of arms are joined by joints having a structure for transmitting rolling motions to the arcuate portions contacting each other to thereby control the drive shaft of the arcuate portions rotationally and thereby move the arms. This transfer arm mechanism is used in various environments including semiconductor manufacturing, such as DRAMs.
申请公布号 US6077027(A) 申请公布日期 2000.06.20
申请号 US19990289677 申请日期 1999.04.12
申请人 HITACHI, LTD. 发明人 KAWAMURA, YOSHIO;KASHIMA, HIDEO;MORIYAMA, SHIGEO
分类号 B65G49/07;H01L21/677;(IPC1-7):B25J17/00 主分类号 B65G49/07
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