发明名称 METHOD FOR HOT STAMPING
摘要 PROBLEM TO BE SOLVED: To emboss a surface of a foil on a face to be hot stamped by forming the face to be hot stamped which has bumps and dips at a surface of a hot stamping member and pressing the foil on the face to be hot stamped by a hot stamping die. SOLUTION: A design composed of characters, figures or the like is printed to a surface of a hot stamping member 1. A toner layer 3 is formed on the member 1. A face to be hot stamped 4 having bumps and dips is consequently formed to the surface of the hot stamping member 1. A foil 5 is placed on the member 1 provided with the face to be hot stamped 4. The foil 5 on the face to be hot stamped 4 is pressured by a hot stamping die 6 while being heated. The hot stamping die 6 has a stamping projecting face 7 formed smoothly to project in the form of characters, figures or the like. The foil 5 has an adhesive layer 8 set to a lower face. In a state in which the face to be hot stamped 4 and the stamping projecting face 7 are registered, the hot stamping die 6 is pressed down to press the foil 5, whereby the foil 5 is pressure bonded only onto the face to be stamped 4 via the adhesive layer 8. Bumps and dips are generated to a surface of the foil 5 and the foil is embossed.
申请公布号 JP2000168155(A) 申请公布日期 2000.06.20
申请号 JP19980348884 申请日期 1998.12.08
申请人 KOBAYASHI KIROKUSHI CO LTD 发明人 TAKATORI SUSUMU
分类号 B41J3/407;B41M1/24;(IPC1-7):B41J3/407 主分类号 B41J3/407
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