SPUTTERING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of shortening the time required for vacuum evacuation and enhancing the efficiency of a deposition treatment. SOLUTION: A gas introducing port 2 which introduces sputtering gas is disposed on one side in a direction orthogonal with the door opening and closing direction of a chamber 1 openable and closable by a door 11 and a vacuum evacuation port 3 is disposed on the other side. The door 11 is provided with a substrate holding section 4. A cathode section 31 is disposed on the wall surface facing the door 11 of the chamber 1. A contamination plate 4 is disposed in proximity so as to cover the outer peripheral part of the substrate holding section 4 and a notched hole 42 is formed in the portion of the contamination plate 41 facing the vacuum evacuation port 3. The contamination plate 41 is so disposed that the vacuum evacuation is made possible even if the contamination plate is disposed in proximity to the outer periphery of the substrate holding part 4 in a nearly hermetically closed state in a manner that the contamination plate exhibits its function.