| 摘要 |
PCT No. PCT/JP96/02523 Sec. 371 Date Mar. 6, 1998 Sec. 102(e) Date Mar. 6, 1998 PCT Filed Sep. 5, 1996 PCT Pub. No. WO97/09383 PCT Pub. Date Mar. 13, 1997A polyoxymethylene resin composition comprising (A) 100 parts by weight of a polyoxymethylene resin and (B) 0.01 to 10 parts by weight of a vinyl compound having a primary acid amide group and an acid imide group is provided. The composition is excellent in heat stability in molding and weatherability and suited for use as a molding material for electric and electronic parts and automotive parts.
|
