发明名称 THROUGH-HOLE PRINTING METHOD
摘要 PROBLEM TO BE SOLVED: To pack a conductive paste uniformly in all through-holes by transferring the conductive paste from the upper surface of a printing substrate mounted on an electrostatic attraction plate to the printing substrate by screen printing and packing the paste into the through-holes of the printing substrate by the electrostatic attraction force of the electrostatic attraction plate. SOLUTION: An electrostatic attraction plate in which a DC power source is connected to an electrode installed in a plastic composite plate is fitted to a fixed board, and roll paper for removing an excessively pushed-out conductive paste is placed on the upper surface of the attraction plate. After a printing substrate for through-hole printing was positioned and mounted on the roll paper, direct current voltage is applied to the attraction plate to generate attraction force by static electricity. In this state, the conductive paste is transferred from a screen to the upper surface of the substrate by a squeegee by screen printing, and the paste is pushed under the through-holes by the electrostatic attraction force of the attraction plate so that the paste is packed uniformly in all the through-holes.
申请公布号 JP2000168039(A) 申请公布日期 2000.06.20
申请号 JP19980345363 申请日期 1998.12.04
申请人 NEWLONG SEIMITSU KOGYO KK 发明人 ICHIKAWA TAKASHI
分类号 B41F15/08;B41F15/20;B41M3/06;(IPC1-7):B41F15/08 主分类号 B41F15/08
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