Spring loaded heat pipe connector for hinged apparatus package

摘要

An improved primary to secondary heat pipe thermal transfer connector for a hinged electronic apparatus package is achieved through the use of a thermal transfer block with a sleeve positioned on the hinge centerline of a hinged apparatus package and in a groove in the thermal transfer block. The primary heat pipe end is fused into the thermal transfer block and all secondary heat pipe ends are fused into the sleeve. The contact interface between the thermal transfer block and the sleeve is spring loaded.