| 摘要 |
PROBLEM TO BE SOLVED: To adjust the gap between a wafer hold head and polishing pad properly and polish a wafer uniflormly by providing a gap adjust mechanism which can adjust the distance size between the wafer hold head and polishing pad. SOLUTION: A wafer is sucked for the wafer sucking seat provided on a carrier, while the projection length from the second hit together part 22 of an adjust member is adjusted. Thereby, when an upperside instalation plate 19 is lowered by an elevator 18 and the lower surface of the first hit together part 24 is contacted with the gap adjust cap of a gap adjust mechanism 23, the lower surface of the wafer and the lower surface of a retainaer are just contacted with the polishing pad 16. Thus, when the wafer is contacted with the polishing pad, a diaphragm is not bent downward. Thereby, the uniformity of the polished surface of the wafer can be ensured favorably. |
