发明名称 BONDED MATERIAL OF CERAMIC MEMBER AND METAL MEMBER AND WAFER SUPPORTING MEMBER USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To effectively prevent formation of a gap on a bonding layer for bonding a ceramic member to a flange part of a metal member by heat stress following a heat cycle and peel of the flange part and to improve durability. SOLUTION: A flange part of a metal member is bonded to a ceramic member by a bonding layer composed of a brazing material and a stress relaxation member having a difference in thermal expansion between the ceramic member and the stress relaxation member of <=2×10-6/ deg.C is bonded to the flange part by a bonding layer composed of a brazing material. The thickness of the stress relaxation member is <=1 mm, its width is wider than the length of the flange part of the metal member, the outer peripheral edge part at the side bonded to the flange part is provided with a notch part 3 and the distance L from the starting point of the notch part 3 to the outer periphery of the flange part is 0<=L<=2 mm.</p>
申请公布号 JP2000169252(A) 申请公布日期 2000.06.20
申请号 JP19980340744 申请日期 1998.11.30
申请人 KYOCERA CORP 发明人 OE JUNJI
分类号 B23K20/00;B23K1/00;C04B37/02;H01L21/68;H01L21/683;(IPC1-7):C04B37/02 主分类号 B23K20/00
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