| 摘要 |
PROBLEM TO BE SOLVED: To allow a plate to be laminated with another printed wiring board after forming a circuit, and also enable semiconductor chips or electric and electronic parts to be adhesion secured thereto by laminating reinforcing copper foil via an adhesive layer on an insulation film of a single-sided copper-foiled flexible base material. SOLUTION: A polyamide acid resin solution is flow applied on a carrier film being a base material to be applied with a releasable insulation film resin to then be semi-dried in order to obtain a polyamide acid insulation film. Next, the polyamide acid film, as-attached with the carrier film, is heat press bonded thereto by having the polyamide acid film surface apposite to the copper foil, after that, the carrier film is released therefrom. The copper foil attached with the polyamide acid film is subjected to drying and annealing operation to permit the polyamide acid to be cyclized for polyimide resin, so that a single-sided copper-foiled flexible base material is obtained. Furthermore, an adhesive resin solution is flow applied on the polyimide resin layer, after that, reinforced copper foil is heat bonded on the adhesive.
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