Semiconductor device and semiconductor system for high-speed data transfer

摘要

A semiconductor system includes at least one logic chip and at least one memory chip arranged such that one side of the at least one memory chip faces one side of the at least one logic chip. The semiconductor system further includes first input/output nodes, provided for the at least one logic chip, for data transfer with an adjacent memory chip, second input/output nodes, provided for the at least one memory chip, for data transfer with an adjacent logic chip, and a package housing the at least one logic chip and the at least one memory chip, wherein the first input/output nodes are arranged along the one side of the at least one logic chip, and the second input/output nodes are arranged along the one side of the at least one memory chip.