System having heat dissipating leadframes

摘要

Electronic system utilizing semiconductor devices having heat dissipating leadframes are provided by using materials, such as copper, which exhibit good thermal and electrical conductivity, and arranging the lead fingers of the leadframe in a configuration which provides good thermal coupling with the surface of a semiconductor die. Micro-bump bonding techniques are employed to provide additional thermal coupling at the electrical connection point of the leadframe fingers to the die. Leadframe fingers exhibiting a high aspect ratio (height:width) are described. Leadframe fingers extending substantially beyond interior bond pads are described.