Pluggable chip scale package

摘要

A structure for packaging an electronic device. The package has: an electronic device having a first surface and an opposite second surface, the first surface having a plurality of first electrical contact locations; a substrate having a surface having a plurality of substrate electrical contact locations; a flexible interposer comprising a flexible material and a plurality of elongated electrical conductors disposed therein and extending from the first side to the second side, each of the elongated electrical conductors has a first end at the first side of the flexible interposer and a second end at the second side of the flexible interposer; the flexible interposer is disposed between the electronic device and the substrate; means for pushing the electronic device towards the substrate so that the flexible interposer is disposed between the first surface of the electronic device and the surface of the substrate so that the first ends of the elongated electrical conductors of the flexible interposer contact the first electrical contact locations at the first surface of the electronic device and so that the second ends of the elongated electrical conductors of the flexible interposer contact the substrate electrical contact locations; and, means for aligning the electronic device to the substrate so that the first and the second ends of the elongated electrical conductors of the flexible interposer align to the first electrical contact pads on the electronic device and to the substrate contact locations, respectively.