| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode material having a composition free from Cr causing environmental problem and excellent in adhesion to a substrate by constituting a sputtering target material of an Ni-base alloy containing specific percentage of V and also constituting an electrode material, which is formed by the sputtering method by using the sputtering target material, of the Ni-base alloy containing specific percentages of V, and to provide electronic circuit components. SOLUTION: The sputtering target material is composed of an Ni-base alloy containing 5-20 wt.% V. The electrode material formed by the sputtering method by using this material is composed of the Ni-base alloy containing 5-20 wt.% V. It is preferable that the electronic circuit components are electronic circuit packaging components having electrodes composed of the Ni-base alloy containing 5-20 wt.% V, further a ceramic capacitor, further a resistance element, further a semiconductor device, and further an integrated circuit. There are no restrictions on the type of material on which the electrode material is formed, though it is desirable to form the electrode material on a ceramic material in particular. Moreover, a layer of coppery material, excellent in adhesion to soft solder to a greater extent, can be further formed on the electrode layer.
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