发明名称 LID SUPPLY MATERIAL, APPARATUS AND METHOD FOR MANUFACTURING THE LID SUPPLY MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method wherein mass production is supported with lids housed in an embossed tape and the same faces of the lids are faced upward for housing in recesses of the embossed tape. SOLUTION: An embossed tape is used as a lid supply material, wherein an entire flat part of the embossed tape and a cover film 2 are bonded by thermocompression bonding. A lid 3 is formed by press-cutting a long two- layered material with solder deposited on one of faces, while the lid 3 is housed in a recess 4 of an embossed tape body 1 placed below a press. Thereafter the cover film 2 is bonded by thermocompression bonding to the entire flat part of the embossed tape.
申请公布号 JP2000168721(A) 申请公布日期 2000.06.20
申请号 JP19980355462 申请日期 1998.12.01
申请人 SENJU METAL IND CO LTD;KTT:KK 发明人 TAKAGUCHI AKIRA;WATA MASAKI
分类号 B23K35/22;B65B15/04;B65D85/86;H01L21/50;(IPC1-7):B65B15/04 主分类号 B23K35/22
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