| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition suitable for an insulating material for a laminated board such as a multilayer printed circuit board, especially the insulating material for the laminated board such as the multilayer printed circuit board obtained by a built-up method by including a specific epoxy resin and a curing (acceleration) agent. SOLUTION: This composition comprises (A) a mixture of (i) >=40 wt.%, preferably >=45 wt.% triphenylmethane-type epoxy resin of formula I (R1 to R4 are each H, a halogen or a 1-5C alkyl; n is 0-10) or biphenyl type epoxy resin of formula II (R5 to R10 are each H, a halogen or a 1-5C alkyl), with optionally (ii) an epoxy resin without the component (i), (B) 0.5-1.5 equivalents curing agent, preferably phenols, amides or the like based on the equivalent of the epoxy group of the component A, (C) 0.01-5 pts.wt. curing accelerator (e.g. triphenylphosphine) based on 100 pts.wt. component A, and optionally (E) an elastomer powder. |
