| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in adhesion or the like to various members such as a lead frame, and usable for encapsulating a semiconductor device by including an epoxy resin, a specified curing agent, an inorganic filler, a curing accelerator and a specific surfactant. SOLUTION: The objective epoxy resin composition comprises (A) an epoxy resin (e.g. a biphenyl type epoxy resin), (B) a phenolic resin curing agent (e.g. a phenol-aralkyl resin), (C) an inorganic filler (e.g. spherical fused silica powder), (D) a curing accelerator [e.g. 1,8-diazabicyclo(5,4,0)undecene-7] and (E) a nonionic surfactant of the formula R-O-(C2H4O)n-H [R is CmH2m+1 (m is >=1), formula I or formula II; n is 4-40] and having 4-40 number of the repeating units of oxyethylene group in the molecule (e.g. polyoxyethylene lauryl ether) in the proportion of 0.02-5.0 wt.%, preferably 0.1-2 wt.%. |
