| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive paste composition for baking applicable to a substrate having a low thermal expansion coefficient such an alkali-free glass for liquid crystal and a structural member fabricated using the composition. SOLUTION: A photosensitive paste composition for baking comprises at least (A) an inorganic powder, (B) a photopolymerization initiator, (C) a photosensitive monomer containing a bifunctional or more acryloyl group, and (D) a photosensitive monomer comprising as a main component a photosensitive monomer containing a monofunctional or more acrloyl group and containing a 4C or more chain, saturated hydrocarbon structure, wherein the inorganic powder (A) includes a glass frit having a thermal expansion coefficient in the temperature range to 50 deg.C-300 deg.C in a range of 50×10-7-100×10-7/ deg.C and a low expansion inorganic powder having a thermal expansion coefficient of not greater than 50×10-7/ deg.C. A structural member is fabricated by a printing method, a transfer method or the like with the use of the composition.
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