摘要 |
A method of forming an interconnection, including a spring contact element, by lithographic techniques. The method comprises successively patterning a first and a second layer of masking material (125, 140) over a substrate (105), each layer of masking material having an opening; depositing a first conductive material (130) after patterning said first layer of masking material and depositing a second conductive material (145) after patterning said second layer of making material to form an electromechanical contact element having: a first portion (130) formed in an opening in said first masking material layer (125) and a second portion (145) coupled to the first portion and formed in an opening in said second masking material layer (140); and removing the plurality of layers of masking material. <IMAGE> |