发明名称 ELECTRONIC COMPONENT TESTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic component testing apparatus which can correctly control a temperature of an electronic part even when the electronic component generates heat by itself at a test time, and can test the electronic component at a desired test temperature. SOLUTION: This apparatus has a connecting terminal 21, to which an electronic part 22 to be tested is detachably connected, a pressing tool 24 for pressing the electronic component 22 in a direction to the connecting terminal to connect the electronic component 22 to the connecting terminal 21, and a cooling device 27 set to the pressing tool 24 for cooling the electronic component 22. For example, a Peltier element is used for the cooling device 27. The connecting terminal 21 and/or a socket 20 can also be cooled directly or indirectly.
申请公布号 JP2000162269(A) 申请公布日期 2000.06.16
申请号 JP19980333864 申请日期 1998.11.25
申请人 ADVANTEST CORP 发明人 TAKAHASHI HIROYUKI
分类号 G01R31/26;H01L21/66;(IPC1-7):G01R31/26 主分类号 G01R31/26
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