| 摘要 |
PROBLEM TO BE SOLVED: To realize a method for polishing wafers which flattens surfaces of the wafers. SOLUTION: In this method, a wafer accommodated in a cassette is transported under a chuck mechanism by a conveying mechanism, and the wafer is attracted to the chuck mechanism, and is pressed on the surface of a polishing cloth of a polishing board 3, and the wafer polishing board 3 is rotated to polish the wafer. At this time, before the wafer is chucked to the chuck mechanism, a wafer surface which is chucked to the chuck mechanism is cleaned by the use of a detergent being irradiated with ultrasonic waves. |
