发明名称 CONNECTOR
摘要 PROBLEM TO BE SOLVED: To enhance durability of a soldered joint part by receiving force acting in insertion of a plug with a substrate to mitigate stress acting to the soldered joint part to a connecting land on the back side of the substrate. SOLUTION: When a connector jack is mounted on a circuit board 58, a lead foot part 44 is inserted into a lead insertion hole 59, and a lead foot part 51 is inserted into a lead insertion hole 60. These lead foot parts 44, 51 are connected to connecting lands 61, 62 on the lower surface of the circuit board 58 with solder 63. By inserting/drawing a pin plug, stress is produced in a jack main body, a signal terminal 43, and lead foot parts 44, 51 installed in a earth metal tool 50. By releasing stress to the circuit board 58 with a projection 45 installed in the lead foot part 44 of a signal terminal 43, and a crooked part 52 installed in the lead foot part 51 of the earth metal tool 50, stress applied to the soldered part and a part of solder 63 is remarkably mitigated, and generation of cracks in the part of the solder 63 is presented.
申请公布号 JP2000164282(A) 申请公布日期 2000.06.16
申请号 JP19980339119 申请日期 1998.11.30
申请人 SONY CORP 发明人 TOYAMA TOSHIO;TAKAHASHI TORU
分类号 H01R13/40;(IPC1-7):H01R13/40;H01R12/22;H01R12/32 主分类号 H01R13/40
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