| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor device, equipped with a heat radiating plate made of graphite fibers arranged in a plate direction extending vertical to the main surface of the plate to be lessened in thermal resistance. SOLUTION: A heat diffusing member 5A formed of a copper plate is laminated on all the surface of a heat dissipating plate 1, made of graphite fibers arranged in a plate direction extending vertically to the main surface of the plate 1. A semiconductor chip 2 is die-bonded at the upper side center of the hat diffusing member 5A, and outer terminals 3 are held at the upside ends of the heat diffusing member 5A with a ceramic material 4. The heat diffusing member 5A and the outer terminals 3 are insulated electrically from each other by the ceramic material 4, and the semiconductor chip 2 and the outer terminals 3 are connected electrically together with bonding wires or the like. |
