| 摘要 |
PROBLEM TO BE SOLVED: To make the overall structure thin and avoid variation in electronic element characteristics by providing electrodes led out of an insulative base, metal caps fixed to seal openings, and an integrated installing strip having a thermal expansion coefficient nearly equal to that of the insulative base. SOLUTION: Ceramic and glass powders are kneaded to prepare a glass- ceramic insulative base 1, having a thermal expansion coefficient of 10-14×10-6/ deg.C which comprises a bottom 2 and a frame 3. Electrode-forming recesses are formed at both sides of the length and recesses 6, 7 for receiving grounding strips formed at both sides of the width are provided. A conductive paste is coated at isolated positions on the upper face of the bottom 2, to form baked electrodes one of which extends to the back of bottom via the end face of the recess and the other of which extends to the back of the bottom 2 after running around beneath the frame 3 and passing over the end face of the other recess. Supports for electronic elements 11, made of the same material and at the same time as the electrodes, are provided.
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