| 摘要 |
PROBLEM TO BE SOLVED: To allow integral fusion without giving an effect to a soldering property at the terminal forming portion of a conductor and without generating a void between parallel conductors by making a hot-melt adhesive sufficiently thick for the fusion between insulating films, and making it thin at adhesive end portions facing the terminal forming portions of the conductors. SOLUTION: One face of an insulating film 2 made of polyester or polyimide is coated with a hot-melt adhesive 3 to the layer thickness sufficient for fusion, and adhesive end portions facing the terminal forming portions of conductors 1 are made thin by the length of 0.5 mm to form a laminated film. The insulating films 2 are arranged to pinch the flat surfaces of the conductors 1 so that the formed layers of the hot-melt adhesives 3 are faced to each other, and the insulating films 2 are heat-pressed by a press or a roll to integrally fusing them. The adhesive layer having no void between the parallel portions of the conductors 1 is formed, and the adhesive 3 overflown by heat-pressing enters the thin portions and is not overflowed to the outside.
|
