| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC package press-fit mounting method, which causes no contact failures or crackings to an IC package. SOLUTION: An IC package is mounted on a board through a press-fit mounting method, where the IC package is equipped with a press-fit pin 2 which corresponds to a through-hole(T/H) 4 provided to the board, and the press-fit pin 2 is press-fit penetrated the through-hole 4. A press-fit pin 2 is provided to an IC package corresponding to an IC pin, even if the IC package is of PGA type, QFP deformed type, DIP type, or in-line type.
|
