| 摘要 |
PROBLEM TO BE SOLVED: To enhance visibility of the marking on a semiconductor device, to improve the recovery rate of a coloring agent and also to facilitate development to already existing equipment and to reduce the cost of marking, in the formation of marking of the device. SOLUTION: A semiconductor device 1 is provided with a groove 2 formed on the upper surface of the device 1 and a powdery coloring agent 3, which is filled in the groove 2, and the coloring agent 3 is cured to form marking, which is high in visibility and is high in the recovery rate of the coloring agent. In the formation of the marking, the groove 2 is formed by laser processing, and after the coloring agent 3 is filled in the groove 2, a surplus coloring agent is removed. After that, the powdery coloring agent 3 is melted and cured, using a heat source or a UV source from above the device 1.
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