发明名称 THERMO-MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermo-module which can be applied to various sorts of power supply, current, and voltage specifications. SOLUTION: Pairs of P-type elements 22 and N-type elements 24 are connected in series via a copper pattern 28 formed on a ceramic substrate 30 through metallization, an outer circuit 34 is formed along an outer edge of the substrate 30, and an inner circuit 36 is formed inside the outer circuit 34. The outer and inner circuits 34 and 36 are connected in parallel at the ends of the substrate 30.
申请公布号 JP2000164945(A) 申请公布日期 2000.06.16
申请号 JP19980340091 申请日期 1998.11.30
申请人 KOMATSU ELECTRONICS KK 发明人 AZECHI MASANOBU
分类号 H01L35/16;F25B21/02;H01L35/28;H01L35/32;(IPC1-7):H01L35/32 主分类号 H01L35/16
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