| 摘要 |
PROBLEM TO BE SOLVED: To obtain a substrate heater for semiconductor-manufacturing equipment, that can stably supply heat to a semiconductor substrate by avoiding the oxidation of a surface that directly makes contact with at least the semiconductor substrate or a susceptor within a heating plate surface, even if oxygen is used as the reaction gas. SOLUTION: In a substrate heater 2 for semiconductor manufacturing equipment, that is provided with an electrical heating element 10 and retains a semiconductor substrate or a susceptor for placing the semiconductor substrate on a surface 12a of a metal heating plate 12, the surface 12a for retaining at least the semiconductor substrate or the susceptor out of the surface of the heating plate 12 is covered with a nonmetal film 20.
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