发明名称 HIGH FREQUENCY RELAY
摘要 PROBLEM TO BE SOLVED: To provide a high frequency relay having stable high-frequency characteristics. SOLUTION: That surface of a base 10 confronting a shield plate 11 is provided with a hole 10a as a sump for a brazing filler material 50 consisting of cream solder. The hole 10a is located between earth terminals 14 adjoining in the longitudinal direction of the base 10 and between terminal pins (stationary terminal) 12a-12c and the earth terminals 14 adjacent thereto. To attach the shield plate 11 to the base 10, brazing filler material 50 in an amount greater than the capacity of the hole 10a is applied to the hole 10a, and the shield plate 11 is laid on the base 10 and the tips 14a of the earth terminals 14 are caulked, and then the brazing filler material 50 is left hardening.
申请公布号 JP2000164099(A) 申请公布日期 2000.06.16
申请号 JP19980333513 申请日期 1998.11.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TAGUCHI TOMOHIRO;NAKAHATA ATSUSHI
分类号 H01H50/10;H01H50/14;(IPC1-7):H01H50/10 主分类号 H01H50/10
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