| 摘要 |
PROBLEM TO BE SOLVED: To enable bonding a wire stably, when deformation like curvature is developed in the island part of a lead frame. SOLUTION: A recess 5b is formed on an island part mounting surface 5a in a heater block 5 which retains a lead frame 1 when wire bonding is performed, in such a manner that the recess 5b has a size that the edge parts 5b-1, 5b-2, 5b-3, 5b-4 are positioned to correspond to electrodes 2a arranged on a semiconductor pellet 2 mounted on an island part 1a. This island part 1a is retained at the edge parts 5b-1, 5b-2, 5b-3, 5b-4 of the recess 5a. |
