| 摘要 |
PROBLEM TO BE SOLVED: To suppress breaks, cracks and defective connections of leads and to resolve the restriction on wiring due to the leads on a circuit board side by improving the stress-resistance of the exposed portions of the leads on an EL panel. SOLUTION: A back electrode layer, a reflecting insulating layer, an emitter layer and a transparent electrode layer are laminated in sequence to form an EL element section 11, and it is sealed by a pair of surface and back packaging films 12, 13 to form an EL panel 20. Leads 18, 19 are provided on the back electrode layer and the transparent electrode layer respectively. The leads 18, 19 are cetained by one packaging film 12 on one face and are exposed on the other face.
|
