| 摘要 |
PROBLEM TO BE SOLVED: To provide a holder for burn-in of a wafer, wherein a pressure of at least 1 kgf/cm2 is applied, while no vacuum conditions are required to be kept during the burn-in. SOLUTION: To perform a burn-in test in wafer state, a holder 7 for keeping the tightly contacted state between a wafer tray 3 and a test card 1 (or a card holder 6) is attached around it. The holder 7 is U-shaped in cross-section which is attached, by inserting sideways, to a peripheral part where the wafer tray on which a wafer 2 is placed is fitted tightly to the test card (or the card holder) by a means such as vacuum-chucking at several points. A burn-in test is performed under these conditions.
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