| 摘要 |
PROBLEM TO BE SOLVED: To enable a platinum metal film to be formed into a fine pattern and easily flattened in a short time by a method wherein a polished part of a platinum metal film provided to a work is converted into compound of high reactivity, and the converted part to be polished is polished through a chemical and mechanical polishing method. SOLUTION: An Ru film 16 except the inside of an opening 14 is chloridized into an RuClx, 17 by heating it at a temperature of approximately 500 deg.C or above in a Cl2 atmosphere. At this point, it is preferable that a protective film of SiO2 or the like is selectively deposited on an Ru surface inside the opening 14 so as to prevent a chloridizing reaction from occurring. Thereafter, the RuClx 17 and a TiN/Ti film 15 are polished through a chemical mechanical polishing method with slurry which contains hydrochloric acid as solvent that dissolves the RuClx 17 to be removed from a second interlayer insulating film 12, and the Ru film 16 and the TiN/Ti film 15 are left only inside the opening 14 to serve as a lower electrode. |
