DIELECTRIC CIRCUIT BOARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a dielectric circuit board which is superior in a high frequency characteristic and which can be miniaturized and to provide a manufacture method. SOLUTION: In a dielectric circuit board, inner conductor patterns 2 formed of low resistant metal materials are arranged between the dielectric layers of a stack body 1 where plural dielectric layers 1a-1e are stacked and via hole conductors 3 which pass through the thickness direction of the dielectric layers 1a-1e and are formed of the low resistant metal materials are formed. A capacity forming part 7 in which upper/lower main faces are sandwiched by conductor films 71 and 73 and which is thinner than the dielectric layers 1a-1e is arranged in a part of the adjacent dielectric layers.