| 摘要 |
PROBLEM TO BE SOLVED: To enhance parts mounting density on a substrate by a method wherein one face of an electrode constituted in a c-shaped configuration is soldered to a plan part and another face is soldered to a circuit substrate. SOLUTION: An electrode is rectangularly punched by a die which is plated in three layers so that a coupling part 18 is left behind, as a band-like body 16. At this time, a feed hole 17 is simultaneously formed, and an electrode 12 is bent in a substantially L-shaped configuration, and is further finally bent in a c-shaped configuration, so that the coupling part 18 of the band-like body 16 and electrode 12 is cut out. The electrode 12 is mounted on a plan part of a substrate 11 by use of a surface mounter for use in mounting of electronic parts 15a, and one plating face 12a of the electrode 12 is connected to the substrate 11 with reflow soldering, and another soldering face 12b is mounted on a circuit substrate 13 for connection. Accordingly, it is possible to fit the electrode on the substrate by use of the normal surface mounter at the same mount step as the other electronic parts to be fitted on the substrate, and to enhance parts mounting density on the substrate.
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