| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mount high-frequency circuit package which is equipped with a sidewall line conductor as a signal input/output on the side of a dielectric board and low in reflection and high in transmission properties to high-frequency signals. SOLUTION: A high-frequency circuit package is composed of a dielectric board 1, equipped with a ground conductor layer 2 formed on its underside or inside it and a mounting region 1a, where a high-frequency circuit part 6 is mounted and a line conductor 3 is provided, extending from around the mounting region 1a to the periphery, a dielectric frame 4 jointed to the top surface of the dielectric board 1, and a sidewall line conductor 5 formed on the side of the dielectric board 1 extending continuously from the line conductor 3, where the sidewall line conductor 5 is formed 1/4 or below as long as the wavelength of high-frequency signals. A high-frequency circuit package of this constitution can be lessened in reflection properties and enhanced in transmission properties restraining the sidewall line conductor 5 from increasing in impedance.
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