| 摘要 |
PROBLEM TO BE SOLVED: To enable a higher-density mounting of ceramic capacitors and resistors by a method wherein, with a plurality of the ceramic capacitors built in a ceramic base, a plurality of the resistors are formed on the surface of the ceramic base. SOLUTION: This chip component 1 has a structure, wherein capacitors (ceramic capacitors) 3 are integrally built in a chip-shaped ceramic base 2 and at the same time, a plurality of resistors 4 are formed on the surface of the base 1. The capacitors 3 in the interior of the base 2 are formed by laminating ceramic capacitors and the constant (capacity) of the capacitors is set according to the number of the laminations of these ceramic capacitors. There are three methods as the method for forming the resistors on the surface of the base 2, that is, there are a method for printing the resistors on the base 2, a method for adhesion-fixing chip resistors on the base 2 by soldering and a method for adhesion-fixing the chip resistors on the base 2 with a conductive bonding agent.
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