| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package structure by which a size of a surface acoustic wave device is made small. SOLUTION: In the surface acoustic wave device 2 consisting of a recessed package formed by a ceramic laminated substrate and a surface acoustic wave element 1 forming an excitation electrode on the piezoelectric substrate, a continuity part 4 is formed to an upper end of the recessed package over a lower end of the package in the inside and a major plane of the surface acoustic wave element 1 is joined to the upper end of the recessed package and the electrode of the surface acoustic wave element 1 is in continuity with the continuity section and an enclosed structure is configured by jointing the surface acoustic wave element 1.
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