HEATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To easily form a temp. profile and ensure the soldering reliability with an easily oxidative lead-free solder having a high solder m.p. by changing the uniformly heating time only. SOLUTION: The heating apparatus is composed of re-heating zones A, B and a regular heating zone C for soldering electronic components to a printed wiring board 2 by blowing hot air on the printed wiring board 2 running by a conveyer. The pre-heating zone A has a plurality of independently controllable hot air units 8 which have blow-off holes shiftable in the conveying direction.